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Investigations of Electrical Resistivity and Thermal Conductivity Dependences on Growth Rate in the Al-Cu-Ti Eutectic Alloy
(SPRINGER/PLENUM PUBLISHERS233 SPRING ST, NEW YORK, NY 10013, 2021)
Directional solidification of Al-Cu-Ti (Al-33wt%Cu-0.1wt%Ti) eutectic alloy was done with a growth rate range (V = 8.58 to 2038.65 mu m.s(-1)) at a temperature gradient of 6.45 K.mm(-1) using Bridgman-type directional ...
The experimental determination of thermophysical properties of intermetallic CuAl2 phase in equilibrium with (Al plus Cu plus Si) liquid
(ACADEMIC PRESS LTD- ELSEVIER SCIENCE LTD24-28 OVAL RD, LONDON NW1 7DX, ENGLAND, 2016)
The equilibrated grain boundary groove shapes of solid CuAl2 in equilibrium with (Al + Cu + Si) eutectic liquid were observed from a quenched sample by using a radial heat flow apparatus. The Gibbs-Thomson coefficient, ...